Intel (Nasdaq: INTC) Latest News about Intel has announced revised details for next-generation USB Latest News about USB 3.0 technology, dubbed "SuperSpeed." The updated draft specifications for USB 3.0 software and hardware interface provide a standardized method for USB 3.0 controllers to communicate with SuperSpeed USB (universal serial bus) software.

The specifications give manufacturers and software developers something to work with as they prep for the transition. The specs also aid in establishing interoperability between devices from multiple manufacturers, an important step in terms of consumer adoption of USB 3.0.

The Intel xHCI draft specification revision 0.9 supports compatibility among various implementations of USB devices and will make it easier to develop software support for the industry, according to Intel. The documentation includes de$criptions of the registers and data structures used to interface between system software and the hardware, which are developed to be compatible with the USB 3.0 specification under development by the USB 3.0 Promoter Group.

"The future of computing Rackspace now offers green hosting solutions at the same cost without sacrificing performance. Make the eco-friendly choice. Click here. and consumer devices is increasingly visual and bandwidth-intensive," said Phil Eisler, AMD (NYSE: AMD) Latest News about AMD corporate vice president and general manager of the Chipset Business Unit.

"Lifestyles filled with HD (high definition) media and digital audio demand quick and universal data transfer. USB 3.0 is an answer to the future bandwidth need of the PC platform. AMD believes strongly in open industry standards, and therefore is supporting a common xHCI specification," he added.

Source: Technewsworld.com
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